With the booming technology and speedy inventions, it’s almost time that we increase our pace too to keep up with all the advancements. Well, IBM is already ready-ing itself to launch next-generation computers and smart phones believed to be 1000 times faster than the system presently in use if the latest reports from Armonk-based IBM headquarters are to be believed. IBM is working on “skyscraper” computers by sandwiching silicon chips by putting together the layers of chips covered with tiny components in proximity. The revolutionary computer is all set to be launched in 2013.
To stick all the layers of chips together, IBM has drawn adhesive maker “3M”. This combined venture will be developing computers as well as smartphones functioning at that high a speed. The research basic intention is to create “stacks” of nearly 100 layers of silicon. Mike Bowman, marketing manager for 3M, has said that their glue fits under the computer chips when attached to printed circuit boards, and that it has a unique property of conducting heat out towards the edge of the sandwich. This glue will disperse uniformly over the chip.
Currently, the 3M Glue makes up adhesives and ultra-fine heat resistant glues for the aerospace indutry. Besides this, it creates sticky tapes too, although it has high stakes in the approaching venture. These highly advanced adhesives that 3M Glue has formulated for IBM, in the end could prove out to be the most essential and evolutionary soar in the garangutan world of Engineering and Technology.
To stick all the layers of chips together, IBM has drawn adhesive maker “3M”. This combined venture will be developing computers as well as smartphones functioning at that high a speed. The research basic intention is to create “stacks” of nearly 100 layers of silicon. Mike Bowman, marketing manager for 3M, has said that their glue fits under the computer chips when attached to printed circuit boards, and that it has a unique property of conducting heat out towards the edge of the sandwich. This glue will disperse uniformly over the chip.
Currently, the 3M Glue makes up adhesives and ultra-fine heat resistant glues for the aerospace indutry. Besides this, it creates sticky tapes too, although it has high stakes in the approaching venture. These highly advanced adhesives that 3M Glue has formulated for IBM, in the end could prove out to be the most essential and evolutionary soar in the garangutan world of Engineering and Technology.
No comments:
Post a Comment